Studies on High Flatness Polishing of Magnetic Disk Substrate with Al2O3 Abrasives (2nd Report)
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چکیده
منابع مشابه
Advances in the CMP Process on Fixed Abrasive Pads for the Polishing of SOI-Substrates with High Degree of Flatness
The new approach using Fixed Abrasive (FA) pads for polishing thick film Silicon-onInsulator (SOI) wafers after bonding and grinding process [1] has been further developed. The aim is a practicable industrial manufacturing process, where the major specifications especially in long term stability and removal rate should be achieved. In base line studies a stable removal rate on suitable level ha...
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Problem statement: Abrasive is one of key influencing factors on the polished surface quality in Chemical Mechanical Polishing (CMP). Solid abrasives in CMP slurries are easy to cause polishing scratches. It is well known that reducing the hardness of abrasives would improve the polished surface quality. Therefore, the change in structure or shape of the abrasives means a change in polished sur...
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in this thesis, a better reaction conditions for the synthesis of spirobarbiturates catalyzed by task-specific ionic liquid (2-hydroxy-n-(2-hydroxyethyl)-n,n-dimethylethanaminium formate), calcium hypochlorite ca(ocl)2 or n-bromosuccinimide (nbs) in the presence of water at room temperature by ultrasonic technique is provided. the design and synthesis of spirocycles is a challenging task becaus...
15 صفحه اولThe Mechanical Polishing Process Based on Pin-on-disk Experiments
In many works on the material removal in the Chemical Mechanical Process (CMP), the effects of several process parameters have been addressed. However, a thorough understanding of the mechanisms of material removal and a model to correlate the process parameters to material removal rate (MRR) are still lacking. This appendix develops such models for polishing based on the results from the pin-o...
متن کاملAchievement of High Flatness of Large Diameter Silicon Wafer in Double-sided Polishing -optimization of Polishing Conditions Based on Kinematical Analysis-
INTRODUCTION Semiconductor devices require silicon (Si) wafers as the substrates to be manufactured with very high flatness for miniaturizing the design rule. On the other hand, the size of wafer is increasing for raising the number of device chips per a wafer for reduction of the process cost. Recently, 300 mm diameter wafers are mainly manufactured, and the feasibility study for 450 mm diamet...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 1994
ISSN: 0912-0289,1882-675X
DOI: 10.2493/jjspe.60.1631